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| HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE6352 Issued Date : 1992.12.15 Revised Date : 2002.04.15 Page No. : 1/4 HMPSA92 PNP EPITAXIAL PLANAR TRANSISTOR Description The HMPSA92 is designed for application as a video output to drive color CRT, or as a dialer circuit in electronics telephone. Absolute Maximum Ratings TO-92 * Maximum Temperatures Storage Temperature ............................................................................................ -55 ~ +150 C Junction Temperature .................................................................................... +150 C Maximum * Maximum Power Dissipation Total Power Dissipation (Ta=25C) ................................................................................ 625 mW * Maximum Voltages and Currents (Ta=25C) VCBO Collector to Base Voltage ...................................................................................... -300 V VCEO Collector to Emitter Voltage ................................................................................... -300 V VEBO Emitter to Base Voltage ............................................................................................. -5 V IC Collector Current ...................................................................................................... -500 mA Characteristics (Ta=25C) Symbol BVCBO BVCEO BVEBO ICBO IEBO *VCE(sat) *VBE(sat) *hFE1 *hFE2 *hFE3 *hFE4 fT Cob Min. -300 -300 -5 25 40 40 50 Typ. 100 Max. -100 -100 -350 -900 6 Unit V V V nA nA mV mV Test Conditions IC=-100uA, IE=0 IC=-1mA, IB=0 IE=-10uA, IC=0 VCB=-200V, IE=0 VEB=-3V, IC=0 IC=-20mA, IB=-2mA IC=-20mA, IB=-2mA IC=-1mA, VCE=-10V IC=-10mA, VCE=-10V IC=-30mA, VCE=-10V IC=-80mA, VCE=-10V IC=-10mA, VCE=-20V, f=100MHz VCB=-20V, f=1MHz, IE=0 *Pulse Test: Pulse Width 380us, Duty Cycle2% MHz pF Classification Of hFE2 & VCE(sat) Rank NS N hFE1 >60 >25 hFE2 >80 >40 hFE3 >80 >40 hFE4 >80 VCE(sat) <200mV <350mV HMPSA92 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Characteristics Curve Current Gain & Collector Current 1000 10000 Spec. No. : HE6352 Issued Date : 1992.12.15 Revised Date : 2002.04.15 Page No. : 2/4 Saturation Voltage & Collector Current 125 C 100 o VCE(sat) @ IC=10IB Saturation Voltage (mV) 25 C o 1000 75 C 125 C 100 o o hFE 75 C o 10 hFE @ VCE=10V 25 C o 1 0.1 1 10 100 1000 10 0.1 1 10 100 1000 Collector Current-IC (mA) Collector Current-IC (mA) Saturation Voltage & Collector Current 1000 25 C o Capacitance & Reverse-Biased Voltage 100 Saturation Voltage (mV) 125 C o 75 C o Capacitance (pF) 10 Cob VCE(sat) @ IC=10IB 100 0.1 1 10 100 1000 1 0.1 1 10 100 Collector Current-IC (mA) Reverse-Biased Voltage (V) Cutoff Frequency & Collector Current 100 10000 PT=1ms VCE=20V PT=100ms Safe Operating Area Cutoff Frequency (MHz).. . Collector Current-IC (mA) 1000 PT=1s 10 100 10 1 1 10 100 1 1 10 100 1000 Collector Current-IC (mA) Forward Voltage-VCE (V) HMPSA92 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE6352 Issued Date : 1992.12.15 Revised Date : 2002.04.15 Page No. : 3/4 PD-Ta 700 600 Power Dissipation-PD (mW) 500 400 300 200 100 0 0 50 100 o 150 200 Ambient Temperature-Ta ( C) HMPSA92 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. TO-92 Dimension A B 1 2 3 Date Code Spec. No. : HE6352 Issued Date : 1992.12.15 Revised Date : 2002.04.15 Page No. : 4/4 2 Marking: H MP S A92 Rank Control Code 3 C Style: Pin 1.Emitter 2.Base 3.Collector D H I E F G 1 3-Lead TO-92 Plastic Package HSMC Package Code: A *: Typical DIM A B C D E F Inches Min. Max. 0.1704 0.1902 0.1704 0.1902 0.5000 0.0142 0.0220 *0.0500 0.1323 0.1480 Millimeters Min. Max. 4.33 4.83 4.33 4.83 12.70 0.36 0.56 *1.27 3.36 3.76 DIM G H I 1 2 3 Inches Min. Max. 0.0142 0.0220 *0.1000 *0.0500 *5 *2 *2 Millimeters Min. Max. 0.36 0.56 *2.54 *1.27 *5 *2 *2 Notes: 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996. 2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material: * Lead: 42 Alloy; solder plating * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: * All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reserves the right to make changes to its products without notice. * HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory: * Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 * Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931 HMPSA92 HSMC Product Specification |
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